ASMPT CEO Robin Ng made it clear that chip designs will keep shifting as AI systems pack in more chips, which means his company’s tech is only gaining importance. ASMPT, a major player in semiconductor assembly, sees that the surge in AI and high-performance computing is driving demand for its advanced thermo-compression bonding (TCB) tools. These tools connect chips in ultra-precise ways needed for complex AI hardware.
Rising AI Deployments Fuel Packaging Needs
Ng explained that as AI models become cheaper and more widely used, the need for inference chips grows, not shrinks. This counters the intuition that cheaper AI might reduce hardware demand. In fact, it pushes it up since more companies adopt AI, increasing inference workloads and, by extension, chips and packaging demand. This aligns with ASMPT’s recent wins, including 19 TCB tool orders in December 2025 specifically aimed at AI and HPC applications.
Positioning for the Multi-Chip Future
ASMPT specializes in chip-on-wafer and chip-on-substrate solutions, which are key for multi-chip modules powering data centers. The company is also collaborating with IBM Research to push next-gen AI chip tech. With AI hardware often focusing on designers like Nvidia, ASMPT’s role shows the critical backend work that connects and packages these chips into functional units. This behind-the-scenes packaging boom is a key part of how AI infrastructure scales.
This material is informational and not financial advice.
